By combining component technologies such as through-hole, bonding and BGA, TRONICO can offer you a highly integrated service.
Available technology
• Through-hole: components mounted on your custom shaped circuit boards
• Bonding
• Surface mount
• BGA : ball grid array allows the size of units to be reduced and permits better heat dissipation
• Wrapping
Our means
• Rotating storage stores
• Screen printing (2D tests)
• Positioning robot
• Convection oven
• Condensation oven
• Vapour phase (low and medium temperature)
• Single and double wave soldering (low, medium and high temperature)
• Selective wave soldering
• Cleaning
• Automatic visual inspection
• X-ray measurement
• Manual recovery
• Repair station
• Memory programming
• Automatic or manual lacquer
• Takaya tests, tests in situ, functional tests
• Tests in operational conditions (temperature, vibration, G-force, pressure...)
TRONICO continually invests in order to answer the needs of its clients for rapid and constant evolution.
