Complete coverage of all technologies
Available technologies:
• Through-hole: components mounted on custom shaped circuit boards
• Bonding
• Surface mount
• BGA : ball grid array allows the size of units to be reduced and permits better heat dissipation
• Wrapping
Manufacture of small and very small sized series
Tronico has more than 35 years experience in the manufacture of small and very small size production runs for harsh environment equipment (oil industry, aeronautics, railway, military...)
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A global service Tronico provides a full range of know-how and services to assist its clients with their projects:
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High temperature expertise |
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Having more than 35 years experience in the manufacture of complex electronic sub assemblies for use in high temperature environments (200°C), Tronico is one of the world leaders in this technology. |
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